His publicity in CsH
4/17/2001: Advances for the futures chips of 10 GHz or more
Finally the first machine prototype has appeared to make chips by means of lithographed with ultraviolet light (in the shape of fluorine laser), what will allow the processors creation tens of times more rapids and memoirs of a lot of major capacity of what we are accustomed nowadays.
The question takes root in that with the current technology, he hopes to go over like much up to 0:1 microns (when companies as ROUTE make already component with integration scales from 0,15 to 0,13 microns, being the most habitual 0:18 microns). The new technology would allow to go so far as to print circuits with an integration thickness between 0,07 and 0,03 microns.
Behind this prototype they are, not any more not less than the American government (across the laboratories Lawrence Berkeley National Laboratory, Lawrence Livermore National Laboratory and Foolish National Laboratories, in California, all of them of the energy department), and a consortium of companies called EUV LLC (in which there are Intel, Motorola, AMD, Micron, Infineon and IBM).
Nevertheless, they plan still certain doubts and enough engineering work stays; perhaps about the year 2005 become a reality in the chips factories. And it is not the only project in march, since the Japanese machinery manufacturers (Canon and Nikon, principally) see with suspicion a program so "Made in USA"...
More information in:
www.intel.com/pressroom/archive/releases/20010411tech.htm
www.eetimes.com/story/industry/semiconductor_news/OEG20010413S0042
Intel presents his prototypes with 0,13 microns technology
Good times for AMD = more factories in his future
Will IBM reach 0:13 microns before anybody?
The production of mikes 0,13 microns Intel will begin about 2001
News written for: Miquel Tarazona